Used SHUEA SW-08 #293587387 for sale

SHUEA SW-08 Wafer Grinding, Lapping & Polishing Equipment is a precision system for grinding, lapping, and polishing wafers from 8-15 inch in diameter. It combines the latest in microprocessor and motion control technologies to create a fully automated unit that can quickly and accurately perform a variety of processes without the need for operator adjustment or intervention. The machine is designed for use in semiconductor manufacturing and for high-volume research and development activities where the highest accuracy and repeatability are required. SW-08 incorporates a servo-controlled grinding and lapping head, allowing precise, controlled grinding and lapping operations. It has a wafer rotation speed of up to 120 rpm and a grinding speed of up to 3000 rpm. A range of grinding discs, lapping plates and polishing heads are available for various applications. The process head is adjustable in height, rotation angle and tilt, allowing for optimal part deposition. The tool includes a high-precision optical sensor for measuring resulting wafer thickness, as well as automated polishing heads for uniform polishing of both sides of the wafer. The control software is designed to interface directly with the wafer grinder, lapper, and polisher to ensure that all processes are executing optimally. SHUEA SW-08 also provides a variety of safety features designed to protect personnel and the equipment. These include an emergency stop button, a protective cabinet to guard against potential abrasive material spills and glove ports for user protection. The asset has an advanced diagnostic and alarm model that allows it to detect potential errors and allow them to be corrected quickly. In conclusion, SW-08 Wafer Grinding, Lapping & Polishing Equipment is an advanced, high-precision tool for grinding, lapping, and polishing round wafers from 8-15 inches in diameter. It combines the latest in machine control and motion control technologies to enable efficient, automated processes with minimal operator intervention. The system provides a range of safety features to ensure user safety and minimise operator error.