Used SHUWA SW-07 #293638640 for sale

SHUWA SW-07 is a fully automatic wafer grinding, lapping and polishing equipment designed to quickly and accurately produce ultra-precision, low-roughness wafers. SW-07 wafer grinder provides up to 5-axis simultaneous motion, enabling it to address a wide variety of grinding applications from simple flat etching to complex contouring shapes on various substrates such as silicon, gallium arsenide, aluminum nitride, stainless steel, titanium and magnetic materials. The system is designed with a CARC feature, allowing it to quickly and accurately process various grinding depths and various hole sizes. SHUWA SW-07 unit is designed for fully automatic operation, enabling one-button operation for accurate grinding and lapping of wafers. An integrated built-in motion control machine makes it easy to program and operate the tool to achieve consistent results. In addition, an integrated total grinding time monitor helps to keep track of progress and ensure the asset's consistent performance. The model also has a temperature monitoring equipment to ensure grinding surfaces remain stable and unchanging. SW-07 also features a polishing system which allows the machine to be used to achieve ultra-smooth surface finishes. It features a closed-loop unit, enabling precise control of polishing speeds, controlled by a highly accurate digital signal processor (DSP) controller. This ensures accurate and repeatable polishing operations to achieve superior surface finishes. SHUWA SW-07 also offers an optional auxiliary wafer loading and unloading machine, enabling it to be used in both manual and fully automated environments. The auxiliary robot is able to quickly and accurately manage the loading and unloading of wafers, eliminating the risk of personnel errors. Overall, SW-07 is designed to be an advanced, reliable and accurate grinding, lapping and polishing tool for producing high-precision, low-roughness wafers. The asset is highly efficient, user-friendly and offers several advanced features to ensure consistent results over extended periods of time. The integrated motion control model and polishing equipment provide precise control over the grinding, lapping and polishing processes. The auxiliary wafer loading and unloading system makes the unit even more versatile, enabling it to be used in a wide range of applications.