Used SHUWA SW-07 #9258271 for sale

SHUWA SW-07 is a high-precision machine for wafer grinding, lapping and polishing. This equipment offers outstanding flexibility in working with hard-to-machine materials such as Silicon, GaAs, Quartz, and other semiconductor crystals. The system is driven by a powerful two-stage grinding, lapping and polishing motor, which provide up to 1500 RPM with millimeter accuracy control. The high-precision grinding tool, lapping plate, and polishing unit are compatible with a wide range of wafer types for different applications. The unit is made of top-grade materials for maximum durability and available in both manual and CNC-version. The grinding head features a unique side-grinding design with four diamond blades, which provides significant resistance to material chipping and deformation. The unit is equipped with a 1/8 inch lapping plate, providing very high precision results on materials up to 2mm thick. The lapping plate is adjustable, allowing it to be easily and safely aligned for exact grinding and lapping operations. The polishing unit includes a polishing pad and a spindle, designed to achieve the desired finish and surface quality. The polishing machine has adjustable speed settings for better polishing control and can be set to run in forward or reverse direction. The machine also features a digital temperature controller, which can be used to regulate the speed and intensity of the polishing process. SW-07 is easy to install and use, and is backed by extensive customer support and maintenance services. The tool is also fully compatible with a range of accessories, such as fitting tools, safety devices, and spare parts for increased convenience and efficiency. The machine is suitable for many types of applications, including semiconductor manufacturing, surface finishing, polishing, and grinding operations.