Used SHUWA SW-08 #293638642 for sale
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ID: 293638642
Wafer Size: 4"
Vintage: 2014
Single side Polisher, 4"
SiC and GaN
Air pressure: 0.5 MPa
Consumables / Accessories
Manuals
Power supply: 200 V, 3 Phase, 15 A
2014 vintage.
SHUWA SW-08 is an advanced equipment designed for wafer grinding, lapping, and polishing operations. This system is capable of machining flat surfaces, and can also be used for processing chamfers, edges, and arc radii. It utilizes an electromechanical linear motor drive with a powerful 20HP spindle, allowing for precise grinding and polishing operations at short cycle times. The unit also features an optimized X/Y/Theta axis configuration that enables in-process measurements and adjustments with precise 3-dimensional control. The grinding, lapping, and polishing tools are integrated into the spindle, which is driven by a high-performance servo motor that can reach speeds of up to 15,000 revolutions per minute. To ensure accurate and precise processing results, the machine is equipped with cutting tool and grinding wheel monitoring systems. For further accuracy, SW-08 comes with a unique high-pressure grinding wheel which can be used to achieve extremely accurate surface finishes. The tool also features an additional advanced measurement asset for measuring and controlling surface texture. This model has functions for measuring surface roughness, surface accuracy, and flatness. When establishing the optimal machining conditions, it can also be used to identify fluctuations in the tool path and orientation of the cutting wheel. To provide user-friendly operation, the equipment is equipped with a user-friendly, intuitive control panel with a 7" color LCD touch screen. This makes the functions of the system easy to understand, with all the necessary functions at the operator's fingertips. SHUWA SW-08 is designed to be installed directly into a cleanroom, eliminating the extra step of having to transfer the workpieces to a separate cleanroom location. The unit also comes with advanced filtration systems for the cooling and slurry systems, ensuring that the finished workpieces are void of contamination. SW-08 is the ideal machine for wafer grinding, lapping, and polishing operations. With its powerful drive spindle, advanced cutting tool and grinding wheel monitoring systems, and intuitive control panel with LCD touch screen, this tool is ideal for meeting the demands of a wide variety of applications.
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