Used SHUWA SW-08 #9258272 for sale

SHUWA SW-08 is a high-precision wafer grinding, lapping and polishing equipment that is capable of achieving superior results with improved accuracy. It is designed to meet a wide range of applications, including microstructuring, polishing, and flatness control for semiconductor processing. SW-08 consists of a twin, vacuum-assisted, cast-aluminum spindle that is capable of operating at speeds of up to 5,000 RPM. The spindles are connected to an automated feed table with adjustable drive speeds. The feed table is designed to move the wafer in longitudinal or rotational x, y, and z directions to achieve uniformity. The feed table also possesses excellent vibration isolation control, making it well-suited for lower-noise operation. Additionally, SHUWA SW-08 has two programmable-frequency height monitors, which ensure precise adjustments to the wafer height of the feed table. SW-08 also features a double-stage lapping mechanism, wherein the first stage is designed for pre-grinding operations such as rough lapping, tape stripping, and oxide removal. This is followed by a second stage finish-lap, where the wafer is subjected to a more precise finishing pass with a low abrasive concentration. SHUWA SW-08 also utilizes a triple-polishing system consisting of two polishing wheels in tandem. It features a single-track multi-processed device that can detect the roughness of the surface and adjust the polishing speed accordingly. In addition, SW-08 features an automated liquid control unit, with timers and end-of-process signals of up to 2000 cycles. Finally, SHUWA SW-08 features an integrated vision machine equipped with a camera that enables probe-level monitoring to help achieve optimal results. In summary, SW-08 is a state-of-the-art, high-precision wafer grinding, lapping and polishing tool that is designed to meet a variety of applications with excellent accuracy and precision. Its features such as the double-stage lapping mechanism, triple polishing asset, automated feed table and integrated vision model make it an excellent choice for any precision grinding and polishing applications.