Used SIL S05-2P #293590873 for sale

SIL S05-2P is a versatile, multi-functional wafer grinding, lapping, and polishing equipment. It is designed to meet the demands of semiconductor, optics, and photonics production environments. It has the capability to grind, lap and polish wafers with diameters of up to 200 mm in a single cycle. The system measures both the wafer's thickness and flatness before and after the lapping and polishing process so that any changes that occur can be monitored consistently. The lapping and polishing tasks are performed with a combination of horizontally rotatable and vertically linear displacement technologies, enabling the unit to reach the desired flatness with a high degree of accuracy. S05-2P is equipped with an advanced control software and a vision machine to ensure the highest precision and accuracy. It features an adjustable head tilt angle, as well as a built-in auto-changeover and calibration program. Moreover, the tool also has a small footprint and is highly automated, which leads to higher productivity and cost-effectiveness. SIL S05-2P is designed to be easy to operate and maintain. It is equipped with an advanced diagnostic and feasibility study asset, as well as interactive video tutorials that enable users to understand the process of lapping and polishing. Furthermore, it has an integrated safety model to protect operators and personnel from technical hazards. The equipment is suitable for an array of production requirements, and can be adjusted to various applications. With robust construction and easy maintenance, S05-2P is an ideal solution for companies looking to produce high precision and level of accuracy in wafer fabrication.