Used SIL S05-2P #293590874 for sale

SIL S05-2P Wafer Grinding, Lapping & Polishing equipment is designed to provide maximum performance in the process of precision surface grinding, lapping and polishing of hard and brittle materials such as Quartz, Silicon, and Ceramic. This system is specifically designed and built to meet the highest quality and performance standards in the industry. S05-2P is designed to be a cost-effective and production orientated solution for processing and polishing wafer materials. The unit cooks up to fifty wafers at a time, allowing for faster turnaround time. A wide range of wafer sizes can be accommodated, from 25.4mm to 205.7mm in diameter. SIL S05-2P operates a high torque stepper motor that drives the lapping and polishing wheels available in a variety of abrasives, from diamond and boron carbide to metal bonded and felt pairs. The machine also includes an adjustable lapping speed and pressure, to ensure consistent results for each wafer size. S05-2P provides a fully automated end result, with an integrated computer control, allowing for easy setup and use. The tool also comes with a built in auto-refresh rate and wafer cycle time control. The integrated user interface is designed for easy viewing and manipulation of the grinding, lapping and polishing data, enabling real-time feedback on process accuracy and results. SIL S05-2P is designed with a heavy duty cast iron base, chassis and V-Door protecting the asset from the environment and accidental damage. The advanced cooling model uses a filtered air equipment and cooling jackets to ensure consistent and uniform temperature control of the grinding and polishing surfaces. This automated grinding, lapping and polishing system provides repeatable, accurate and efficient results. S05-2P is a market leading solution for manufacturing of single and multiple-sided wafers with a rolled edge and high surface finish quality. This process is well suited to a wide range of applications, in the production and research sectors.