Used SIM / FTA WAU-1005 #9124715 for sale
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ID: 9124715
Vintage: 2009
Reloader
With buffer
System-compressed air connection
Connection pressure: 8-9 Bar
Nominal pressure: 7 Bar
Nominal width: 1/2"
Power supply: 3 x 400 V, 50 Hz, 2 kVA, 3 x 32 A
2009 vintage.
SIM / FTA WAU-1005 is a wafer grinding, lapping and polishing equipment specifically designed to process hard and brittle materials. It is a versatile and cost-effective solution for preparation and finish of metal, ceramic and composite materials. Its construction incorporates the latest advances in automated wafer hydration, lapping and polishing technology with the dependability and precision of the FARO wafer processor. SIM WAU-1005 is designed for handling and analyzing wafer samples up to 8" in diameter. This state-of-the-art machine provides an exceptional finish and accuracy for grinding, lapping and polishing even the most challenging materials. An automated lapping process removes any irregularity from the surface of the wafer. It effectively smooths out surface defects, creates multiple flat surfaces and creates an even level of roundness and parallelism. The polished surface of the wafer is then inspected to ensure that all of the features have been correctly pressed into place. A super-precision gauge reveals any inconsistencies between the measured value and the finished wafer profile. The system also has a built-in roughness inspection unit to examine and detect any anomalies in the material finish. FTA WAU-1005 is configured with an air-compressor facility that may be used to provide a continuous water supply for the grinding and lapping process. This feature is designed for operation in cleanroom environments. The unit has a number of controls that can be adjusted to accommodate different materials and to produce different finish characteristics. Finally, the machine is powered by a high-torque servomotor and is designed for repeatable performance and long life. It also includes software that allows the user to save a copy of the program for future use. In summary, WAU-1005 is an ideal solution for precision grinding, lapping and polishing of a wide range of materials. The rugged construction and versatile controls of this tool make it an ideal solution for any wafer fabrication facility.
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