Used SIM RRF / 660 #9066958 for sale

SIM RRF / 660 is a wafer grinding, lapping and polishing equipment designed for high performance, automated operations for the precision machining of wafers and substrates. It is equipped with three independent grinding/lapping/polishing heads, allowing for increased productivity and decreased cycle time. Additionally, the system offers a wide variety of process parameters, giving the user greater control over their process. RRF / 660 is designed to grind, lap, and polish substrates with high accuracy and in an efficient manner. The unit is equipped with an integrated Siemens Sinumerik 840D controller, in addition to a vacuum-sealed chamber and a high-precision spindle. The vacuum-sealed chamber allows for accurate, repeatable process control and ensures high quality results. The high-precision spindle ensures precise wafer grinding, lapping, and polishing results, making it ideal for high quality semiconductor applications. SIM RRF / 660 boasts a variety of automated features. For example, its integration of loaders and unloaders allows for efficient custom loading and unloading of various substrates and wafers. Additionally, the machine features full alignment features for improved accuracy as well as indexer and process tracking for easier operation. RRF / 660 is also capable of performing a wide range of wafer and substrate processes. These processes include wafer grind, lap and polish, as well as surface profiling and chemical-mechanical polishing. Additionally, the tool is equipped with optional beam reduction and cleaning modules, which improve process precision and reduce asset down time.