Used SINTO Edge Master EM-ML #9055807 for sale

SINTO Edge Master EM-ML is a wafer grinding, lapping and polishing equipment ideal for semiconductor manufacturing and production processes. This system provides a range of features including precision grinding control, precise positioning, uniform lapping across the entire wafer surface, and uniform surface finish over large diameter wafers up to 200mm or 8" in dimeter, all with an excellent repeatability and reproducibility. The EM-ML offers a wafer grinding motion by using two spindles with stepper motors for wafer positioning from rough to fine grinds. The unit also has a compound polishing treatment with special abrasive paste and wafer rotary transfer, making sure that uniform results are achieved and that the wafer surface is free from all values of damage. The rotary table carries out lapping and precision polishing tasks, providing accurate performance up to very close tolerances and ultra-smooth surface finish. In addition to the above capabilities, the EM-ML also has an advanced optical machine designed to detect wafer locations and track wafer rotations, monitoring the rotational position of the wafer during grinding, lapping, and polishing. Moreover, the tool features a built-in camera allowing for automated wafer dicing and fine tuning. All components of the asset are designed for easy maintenance and operation. The model also comes with an intuitive graphical user interface (GUI) which allows for simple and easy control of various functions associated with the equipment. Furthermore, Edge Master EM-ML is designed to provide the most efficient and productive process and provides total fabrication solutions for a wide variety of industries. It is a comprehensive solution for semiconductor device fabrication that results in cost-effective production of high-precision wafers.