Used SOLID STATE MEASUREMENTS 7 #9168959 for sale

SOLID STATE MEASUREMENTS 7 is a highly precise 'wafer grinding, lapping & polishing' equipment that enables precision measurements and finishes on a variety of semiconductor materials. This system is comprised of two robots, one for grinding and one for polishing. The grinding robot is used to accurately remove material from the semiconductor material to create precise features on the surface. The polishing robot is used to refine and smooth the surface, in order to finish the features created by the grinding robot with a very high degree of precision. Additionally, the unit is capable of measuring and analyzing the results of the grinding and polishing process, in order to further refine the results. The primary feature of the machine is its precision capabilities. It is capable of removing material and polishing surfaces with an incredibly high degree of accuracy, enabling it to work with current semiconductor fabrication technologies that require features as small as 0.1 μm. This accuracy is achieved partly through advanced control algorithms and thermal compensation, using powerful CNC controllers and FPGAs. The tool also utilizes a high-precision, multi-axis machining platform and a precision rotary table to ensure the measurements and results are as accurate as possible. The asset itself is user-friendly, with the ability to integrate easily with existing production and laboratory environments. The software interface is intuitive and easy to use, while also offering a range of advanced features such as the ability to define custom recipes and integrate with other systems. This combination of usability and precision makes the model an ideal choice for semiconductor manufacturers and research institutions alike. This equipment is also highly durable. It is constructed from stainless steel and is equipped with a range of protective features to ensure it's able to withstand the harsh production environment. Additionally, it has been tested to withstand extreme temperatures and pressure, making it suitable for use in a variety of different environments, from research laboratories to industrial-scale production facilities. In conclusion, 7 is a highly precise, user-friendly 'wafer grinding, lapping & polishing' system that enables precision measurements and finishes on a variety of semiconductor materials with an incredibly high degree of accuracy. It is also extremely durable, making it an ideal choice for a variety of applications, from research laboratories to industrial-scale production facilities.