Used SOUTH BAY TECHNOLOGY 920 #9163549 for sale
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ID: 9163549
Polisher
Left and right drive units
Includes:
Tools and manuals
Slurry pump
Tubing and reservoir bottle.
SOUTH BAY TECHNOLOGY 920 is a wafer grinding, lapping, and polishing equipment that is capable of grinding, lapping, and polishing to exacting specifications within nanometer tolerances. The system is composed of a variety of components, including a grinding table, grinder, and lapper, each of which play an important role in the manufacturing process. The grinding table of 920 is a precision device designed to hold and manipulate wafers during grinding and polishing operations. This table is equipped with a vacuum to ensure that the wafer is securely held in place, as well as with a variety of adjustable mounts to enable the desired amount of pressure to be applied during each operation. The grinder of SOUTH BAY TECHNOLOGY 920 is powered by an industrial-grade motor, and is controlled by a computer-based controller. This grinder utilizes diamond grinding discs to grind and polish the surface of the wafer with precision and accuracy. The grinding disc is held in contact with the wafer surface by the adjustable mount, and the motor is configured to constantly adjust the pressure and speed of the grinding disc. The lapper of 920 is used to achieve a smooth finish to the wafers' surface. This lapper utilizes a diamond-coated lapping plate and adjustable rollers to accurately control the pressure, speed, and direction of the lapping motion. The lapping discs are designed to reduce the surface roughness of the wafer until it meets the desired specifications. In addition to its grinding, lapping, and polishing components, SOUTH BAY TECHNOLOGY 920 is also equipped with a series of sensors that monitor the process during each operation. This unit can detect and adjust to small changes in operating conditions, such as the temperature or pressure of the grinding table, ensuring that the process is being performed accurately and consistently. In summary, 920 is an advanced wafer grinding, lapping, and polishing machine that provides precision and accuracy within nanometer tolerances. This tool is composed of a grinding table, grinder, and lapper, as well as a variety of sensors that monitor the process during each operation. The asset is designed to ensure consistent results, meeting even the strictest of specifications.
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