Used SPEEDFAM 10.5B-5L-V #9237028 for sale

SPEEDFAM 10.5B-5L-V is a precision wafer grinding, lapping, and polishing equipment designed for completing advanced scar-free fine planar machining. It has a cooling system, wide range of diamond slurry polishing capabilities, and is capable of grinding and polishing wafers up to 300mm in diameter. The 10.5B-5L-V is a double-disk unit equipped with a 4-axis motion control machine, allowing for the precision control required for achieving a variety of highly specialized surface finishes. The tool can support up to 5 abrasive grinding/polishing disks, each of which can be adjusted for speed, width, and angle, allowing for a customized process for each application. The head feed is driven by a precision linear feed asset that ensures high-precision repeatable motion. The machine also features a vacuum chamber to help prevent debris from contaminating the work surface. SPEEDFAM Wafer Grinding Model features a fully enclosed cabinet to improve safety and provide a clean and dust-free environment. The equipment is equipped with a series of pressure regulators, flow sensors, and in-line filtration to ensure that the right combination of pressure and volume is consistently supplied to the grinding/polishing disks, resulting in high-quality, repeatable results. The system also includes process validation features, which make it ideal for production environments. Robust data logging allows for a central unit for maintaining detailed records of each grinding or polishing cycle, as well as the changes and adjustments made along the way. The machine also includes automatic tool wear compensation and grinding speed control, ensuring that users can achieve precise repeatable results time and time again. SPEEDFAM 10.5B-5L-V is designed to excel in the most demanding of applications. Whether you are working on semiconductor and photonics components or advanced materials, the 10.5B-5L-V offers the highest levels of accuracy and precision for highly demanding surface finishes.