Used SPEEDFAM 10.5B-5L-V #9257685 for sale

SPEEDFAM 10.5B-5L-V is a professional-grade wafer grinding, lapping, and polishing equipment designed for use in semiconductor production facilities. The unit's 10.5-inch platen provides up to five-micron accuracy with low-vibration operation. The system includes spindle speeds from 12,000 to 35,000 RPM and 5 up to 50 N-cm grinding forces. The variable-speed conveyor allows quick wafer loading and unloading and variable-speed grinding. The 10.5B-5L-V offers users a three-step wafer finishing process, consisting of preliminary grinding, lapping & polishing, and final polishing. A 250-watt LED headlight and an integrated slit pattern diamond provide the necessary illumination for wafer polishing. The unit utilizes a precision four-bearing spindle design, with tilt bearings that remove heat generated during higher RPM grinding. This prevents distortion and ensures precise polishing results. The low-vibration design also reduces vibration in smaller components during grinding operations. The 10.5B-5L-V has an integrated air-float machine which provides smoother operation and better wafer grinding and polishing accuracy. Its ceramic lapping plate offers a homogeneous surface for better flatness, while five custom-configured peripheral grinding blades quickly remove material from the edges of wafers. The tool also includes an integrated cooling asset which ensures superior sliding during polishing operations. Furthermore, the 10.5B-5L-V is equipped with a microprocessor-controlled operating model and user-programmable functions, making it extremely easy to use. For better process control, the 10.5B-5L-V includes a real-time data tracking equipment that records grinding parameters, quality control data, and other important parameters. This data can be used to adjust process parameters for better throughput and reliability. With its low-vibration operation, variable-speed grinding, microprocessor-controlled operation, and real-time data-tracking, SPEEDFAM 10.5B-5L-V offers an easy and reliable solution for wafer grinding, lapping, and polishing operations in semiconductor production facilities. Its user-friendly design and reliable performance make it the perfect choice for any wafer processing environment.