Used SPEEDFAM 10.5B-5L-V #9353060 for sale

SPEEDFAM 10.5B-5L-V is a single-pass wafer grinding, lapping and polishing equipment designed to produce ultra-flat surfaces on semiconductor wafers. The machine offers a unique combination of components and functions for producing the required high quality finishes on both doped and undoped materials. This model offers a high degree of accuracy and control, with its automated controls and robust design allowing for full circulation grinding and lapping that produces a high quality result. The grinding and lapping components of the machine are powered by an efficient and reliable drive system. This unit features a high-spec VFD Motor Controller, which allows for precise control of the speed and feed rate. A special cooling unit ensures that the machine works at a fixed temperature for optimal performance. The machine also includes the latest advancements in grinding, lapping and polishing technology with several advanced features. The machine uses an advanced grinding stage to eliminate surface imperfections and to provide a uniform surface finish. The stage has an abrasive material that is forced against the substrate with heavy pressure, as well as a vector design that eliminates the risk of overlooking surface imperfections. This stage is also coupled with lapping and polishing operations to achieve the desired level of finish. The lapping process involves the use of a special abrasive material that is run in a circular motion over the substrate until the desired surface finish is achieved. This process is facilitated by the machine's rotating lapping wheel, which produces an even and consistent polish. Furthermore, the lapping process is terminated by a precision diamond blade that guarantees a consistent surface finish, thereby eliminating any imperfections. The polishing stage of the machine allows for the production of finer finishes. This is accomplished by the use of specially designed polishing pads and diamond-tipped blades. These components work together to offer the highest quality results possible. A special scrubber tool is also included to remove contaminants from the substrate surface. Finally, SPEEDFAM 10.5B-5L-V Wafer Grinding, Lapping and Polishing Asset is integrated with an easy-to-use operator interface. This interface allows users to customize and monitor the machine's settings to ensure optimal product quality. The model also offers complete production traceability, allowing for accurate tracking of all operations. In conclusion, SPEEDFAM 10.5B-5L-V is a powerful and efficient wafer grinding, lapping and polishing equipment. This model is equipped with a wide range of advanced features to guarantee the highest quality results. Additionally, its operator interface offers low maintenance and intuitive user control that minimizes production cycle times. All of these features combine to provide a superior wafer processing system with good traceability and productivity.