Used SPEEDFAM 12B-1327 #9276208 for sale

SPEEDFAM 12B-1327 equipment is a high-precision wafer grinding, lapping & polishing machine designed for semiconductor and optoelectronic components. This system is capable of achieving grind accuracies up to 0.2 µm, allowing for highly accurate and repeatable results. SPEEDFAM unit is equipped with two grinding spindles, each with their own motor and spindle head, as well as two integrated parallel lapping and polishing spindles that are designed to ensure uniformity of grinding and polishing operations. Its unique design allows for high-precision grinding and lapping of irregular shaped components with minimum manual intervention as well as the ability to automatically adjust the polishing pressure for each individual process step. The machine comes with a controller that has user-friendly PLC programming with sophisticated features such as a real-time data logging tool and traceable traceability for both the grinding and polishing operations. This integrated asset eliminates the need for tedious set-up and programming, and makes it highly efficient and reliable. The Wafer Grinding Spindle heads are fitted with patented Abrasive Basket Assembly which ensures uniform grinding results across the entire surface of the wafer. The grinding head is supported by three grinding rollers that can be easily replaced while maintaining the same grinding profile. Additionally, the head is supported during the grinding and polishing processes by a two-stage loading period, ensuring uniform texture and surface finish. The Lapping Spindles are fitted with an automatic head-docking model that adjusts the working pressure due to each wafer's surface profile. This eliminates the risk of over-lapping and under-lapping during operation, increasing the reliability of the process. The Polishing Spindles are fitted with patented Auto-Adjustable Polishing Heads that provide accurate pressure on each individual wafer, resulting in superior polishing results. It also can be programmed for advanced polishing techniques such as waveform-polishing and patterning, as well as conventional and advanced polishing media types, allowing for greater flexibility. 12B-1327 is a highly versatile equipment for automated wafer grinding, lapping and polishing operations. With its user-friendly programming and high-precision results, it is an ideal choice for semiconductor and optoelectronic components processing.