Used SPEEDFAM 12B-5L #293795196 for sale

SPEEDFAM 12B-5L is a wafer grinding, lapping, and polishing equipment that offers a wide variety of features and benefits for applications requiring high precision and efficiency. 12B-5L can process front and backside wafer diameters up to 5 inches. It is equipped with a variable-speed DC motor that allows varying grinding speeds from 9,000 to 45,000 RPM. SPEEDFAM 12B-5L includes a safety interlock system, which prevents access to the grinding area and prevents the machine from operating until the interlocks are cleared. 12B-5L utilizes a constant-pressure grinding technology to ensure the uniformity of the surface finish on the wafers. The automatic compensation control feature compensates for the grinding pressure, ensuring uniform finish and accuracy. The unit also includes a dies-centered disc, allowing for exact wafer concentricity and positional accuracy. Additionally, SPEEDFAM 12B-5L is equipped with a variable-feed rate to minimize process time and reduce the risk of over-grinding and under-grinding. 12B-5L features a rotary table indexing machine that allows for safe and easy loading and unloading of wafers. The Table Indexer Tool consists of four coarse driving screws and four fine driving screws, each independently driven by the high-speed motor, allowing for precise movement of the table to the desired position. SPEEDFAM 12B-5L also includes an index grinding attachment, which can be quickly mounted to perform special operations such as radius grinding, profile grinding, and heel chamfering. The index grinding attachment is equipped with a movable slide block that can move 45 degrees forward and backward, allowing for greater flexibility in the grinding operation. In addition, 12B-5L is also equipped with a pressure-adjustable vacuum chuck, allowing for a tight hold on the wafer during the grinding operation. This vacuum chuck forms a highly reliable grip on the wafer, providing a consistently smooth and accurate surface finish. Overall, SPEEDFAM 12B-5L is a state-of-the-art wafer grinding, lapping, and polishing asset designed for applications requiring high precision and efficiency. It provides a wide range of features and benefits that make it the ideal model for operations requiring a high level of accuracy and consistency.