Used SPEEDFAM 12B-6L #9073041 for sale

SPEEDFAM 12B-6L wafer grinding, lapping and polishing equipment is a multi-purpose machine for grinding, lapping and polishing a wide variety of wafers and flat surfaces. It is designed to produce high quality parts with excellent process repeatability at an economical cost. 12B-6L utilizes a variety of polishing processes, including metal bond diamond honing, hard lapping on semiconductor wafers and surface polishing of flat components. SPEEDFAM 12B-6L system consists of a fixed platform in which the wafer is secured. The platform can be set to different heights for different wafer size and shape, allowing the operator to have maximum flexibility during the grinding, lapping and polishing processes. The unit also features an accuracy of 0.05mm and adjustable rotary slide and speeds of up to 900rpm. To ensure a precise and consistent finish, 12B-6L includes a built-in precision feed mechanism that is operated by a foot pedal. The unit also includes an integrated load monitor that further ensures precision and accuracy. In addition, lightening and shading of the workpieces can be accomplished with the use of interchangeable grinding stone wheels. SPEEDFAM 12B-6L is well-suited for supporting a wide range of wafer processing applications. This includes optical glass cutting, optical polishing, mirror surface grinding, thin film lapping, ultra-precision grinding and polishing, glass-ceramic and ceramic lapping and polishing, and CVD/CMP diamond lapping and polishing. 12B-6L is designed to provide the highest quality results available in the industry, while providing the operator with an easy to use, reliable, and economical wafer grinding, lapping, and polishing machine. By providing consistent quality results with excellent process repeatability, SPEEDFAM 12B-6L is an ideal solution for any wafer processing application.