Used SPEEDFAM 12B-6P #9208752 for sale

SPEEDFAM 12B-6P is a state-of-the-art wafer grinding, lapping and polishing equipment designed to process specifications of the highest quality. This system comes with a fully automated, robotic tail stock designed to accurately process and evaluate wafers at high speeds with repeatable results. The robotic tail stock also features a patented spindle design. This spindle is precision-machined from a solid block to insure that the material is cut uniformly. 12B-6P also incorporates a multi-axis robotic control unit, allowing for precise grinding and lapping with minimal user interaction. SPEEDFAM 12B-6P is constructed from heavy-duty materials to provide long-term durability. The machine is equipped with a powerful motor and drive train to enable optimal wafer grinding and lapping processing speeds. It also features a conveyor machine for the safe and efficient transfer of heavy wafers to the grinding and lapping processes. The tool's controls are also designed to enable high-precision processing of wafers. 12B-6P is equipped with a computer numerical control (CNC) asset for controlling the grinding and lapping process. This CNC model allows for the accurate control and grinding of wafers to meet tight tolerances. The equipment also provides a variety of grinding and polishing tool options to enable users to customize results. In addition to incorporating cutting-edge technology, SPEEDFAM 12B-6P also places an emphasis on safety. The system is designed to prevent accidental damage to wafers though the use of a patented dust collection unit. This machine collects dust during the grinding and lapping process and stores the particles in a sealed collection chamber for easy clean-up. Overall, 12B-6P is a powerful wafer grinding, lapping and polishing tool designed for high-precision processing and maximum safety. Its cutting-edge technology and robust materials make it an excellent choice for any processing requirements.