Used SPEEDFAM 12B-8L #9114397 for sale

SPEEDFAM 12B-8L is a robust, user friendly wafer grinding, lapping and polishing equipment designed mainly for the manufacturing of semi-conductor devices. This system is based around a large, modular construction which enables various levels of automation and flexibility within the processing of a wide variety of different wafer materials. 12B-8L has an automatic grinding table which holds up to 24 wafer boats with a maximum wafer diameter of 8 inches, allowing for parallel processing and cost efficiency in large scale production. Furthermore, the grinding table is equipped with a linear motor drive which provides accurate and stable speed control of the grinding table, giving superior wafer-to-wafer consistency. The following step in the process is lapping, where abrasive is dispensed onto the flat surface of the wafer and it is lapped down simultaneously and consistently with the lapping heads. SPEEDFAM 12B-8L is equipped with a 2-axis adjustable lapping head, allowing the lapping process to be regulated accurately and efficiently. The adjustable head also enables high quality flatness for each wafer, as well as flexibility to respond to the needs of a wide range of materials. The last stage is polishing, where the excess material from the lapping process is removed and given a reflective finish. The unit uses a wide range of standard polishing consumables and accessories (such as slurry, polishing pads and discs) which give the wafers a smooth and glossy finish. The polishing heads are equipped with an active load control unit which ensures a consistent material removal rate throughout the process. 12B-8L is an efficient wafer grinding, lapping and polishing machine designed for the production of semi-conductor devices. It utilises a large, modular construction with adjustable and automated controls to facilitate accurate and consistent results in large-scale production. Further features include a linear motor drive, 2-axis adjustable lapping head and active load control unit, all of which help ensure optimal wafer results.