Used SPEEDFAM 12B-8P III #293626845 for sale

SPEEDFAM 12B-8P III is an advanced wafer grinding, lapping and polishing equipment designed to deliver superior surface finish results on a wide variety of hard and brittle materials. This system is capable of polishing planar and non-planar surfaces with high precision, swiftly and accurately for application in semiconductor production facilities. The unit is comprised of 12 grinding and polishing heads, 8 polishing heads, a feed tray for wafers, a polishing pad and a structured platen for polishing operation. It allows the use of diamond-abrasive slurries or fluids for polishing, with adjustable water pressure and flow rate. It also allows the use of flexible paper tapes for grinding operations. The machine is designed around a robust frame and features an automatic spindle control tool, precision linear motors and encoders, and a rigid construction that minimizes vibration during operation. The motor and encoders provide highly accurate feed rate control, which allows finer adjustments in surface finish without sacrificing consistency. It also features a high-resolution touchscreen control asset, which simplifies and streamlines the setup and operation of the model. SPEEDFAM 12B-8P-III also features an advanced safety interlock equipment, which ensures the safety of the operator and wafers by immediately suspending operation if necessary. It also includes a powerful recirculating system for water and abrasive particles, which minimizes environmental impact and reduces maintenance costs. Overall, 12B-8P III is an advanced and reliable unit that provides superior surface finish results for all kinds of hard and brittle materials. It also offers high degree of operator safety, ease of setup and operation, and minimal environmental impact.