Used SPEEDFAM 12B-8P III #9100162 for sale

SPEEDFAM 12B-8P III is a wafer grinding, lapping and polishing equipment, specifically designed for the semiconductor industry. It combines the capabilities of a single-head and multi-head grinder, a lapper and polisher to enable the user to effectively and efficiently cut and polish wafers and other thin materials. The machine features a 12 inch diameter table and 8 inch diameter tooling, allowing for a wide range of size and shape substrates to be processed. All machine functions are controlled by PLC panel with a LCD display, providing the user with clear informative graphics to enable easy set-up and operation. In addition to its size and shape capabilities, SPEEDFAM 12B-8P-III offers high precision grinding, lapping and polishing, ensuring the highest quality of finished product. The machine features a wide range of cutting/polishing heads to process different processes, including surface finishing, stock removal, and deburring. The combination of these capabilities allows the user to optimize process parameters and achieve the desired substrate finish. In order to maintain a high level of precision, 12B-8P III features a sophisticated 3-axis control system. This ensures accuracy and consistency from one substrate loading to the next. The machine is also equipped with an X-Y platform to facilitate precise, regular stress relief loading, thereby eliminating any possibility of unequal stress distribution. 12B-8P-III is also provided with a range of advanced features, such as vibratory table for smooth operation, safety hoods, coolant and vacuum systems to prevent contamination of the wafer surface. The machine also comes with a built-in chiller for cooling during grinding operations. Finally, the machine is mobile to facilitate easy transport and installation. In conclusion, SPEEDFAM 12B-8P III is a highly advanced wafer grinding, lapping and polishing unit designed to provide precise and consistent grinding, lapping and polishing results. This machine offers a wide range of capabilities, from finish surface treatment and stock removal, to precise stress relief loading patterns. It also features an advanced 3-axis control tool and a range of safety features to ensure high levels of protection and accuracy. The machine is also mobile and can be easily transported and installed. By combining the functionalities of a single-head and multi-head grinder, a lapper and polisher, SPEEDFAM 12B-8P-III effectively and efficiently cuts and polishes wafers and other thin materials.