Used SPEEDFAM 12B #293639920 for sale

SPEEDFAM 12B Wafer Grinding, Lapping & Polishing Equipment has been developed to address the need for superior surface finishes on sensitive and difficult-to-machine materials used in today's integrated circuit and MEMS fabrication processes. The system is designed to provide reliable and repeatable polishing results on wafers, wafer buttons, dices, and other thin-film substrates. The unit utilizes an advanced static and dynamic polishing technology to produce finished surfaces. The machine's foundation is a heavy-duty, dual layer isolation base, which helps to provide excellent vibration control allowing for superior results. Also, the tool is designed with a full-featured control panel, allowing for convenient and straightforward operation. 12B comes equipped with a 12-inch grinding and polishing platen which is capable of covering a wide range of grinding and polishing procedures. Furthermore, the asset is capable of holding up to three different abrasive belts at the same time, so different wafers and substrates can be processed simultaneously. The frame also includes a fixed length platen with straight edges which ensures a consistent grinding cut for every wafer. The model also includes a separate lapping device which can produce precise, uniform finish on wafers and thin-film substrates. It consists of a radial arm, which is driven by an electric motor, and a platen that rotates at a fixed speed. The arm holds wafers or thin-film substrates in place and have a set of adjustable lapping wheels that allows you to adjust the lapping rate to achieve the desired finish. The equipment also comes with accessories specially designed to enhance your grinding and polishing workflow. These accessories include a polishing pad adapter that allows you to attach different polishing pads and a Platen Plate Adapter, to reduce vibration and improve stability. In addition, the system is also outfitted with a wafer transfer unit to aid in transferring wafers without contaminating the wafer surface. SPEEDFAM 12B Wafer Grinding, Lapping & Polishing Machine is an ideal solution for achieving superior surface finishes on sensitive and difficult-to-machine materials used in today's advanced fabrication processes and for achieving precise, uniform finishes on large-scale wafers and thin-film substrates. The tool's robust design and advanced technology provide reliable and repeatable polishing results.