Used SPEEDFAM 12B #293829601 for sale

SPEEDFAM 12B is a wafer grinding, lapping and polishing equipment designed to produce precision microstructures with superior surface planarity and roughness. This system is specifically designed to meet the requirements of microelectronics and dielectric fabrication industries. 12B unit is a modular machine, with interchangeable components that allow it to be tailored to the specific application. Every component in the tool is designed around a three-axis servo-controlled motion platform. This allows for superior accuracy and control over the production process, eliminating the need for manual intervention. The asset is equipped with a variety of grinding, lapping and polishing tools. For grinding operations, it is equipped with either diamond wheels, silicon carbide wheels, or ELID wheels, depending on the material type and application. The model is also equipped with a 6-inch chuck for workpieces up to 12 inches in diameter. Lapping operations are facilitated through the use of abrasive slurry media. It is capable of delivering both wet and dry lapping operations for all materials. The equipment also incorporates a polishing wheel that is automated and precisely controlled for accurate and repeatable operations. SPEEDFAM 12B offers advanced process control functions, allowing the operator to maintain precise control over the grinding, lapping and polishing operations. An on-board data port can be used to interface with external data logging systems, allowing for easier, more accurate data collection. The system also features a variety of safety features, such as safely hoods and automatic shutoff, to ensure the safe and efficient use of the equipment. 12B is an efficient, precise and cost-effective solution for microelectronics and dielectric fabrication operations. It is capable of meeting tight tolerances and process specifications, with repeatable results. The unit is easy to use and maintain and produces superior surface finish results for a wide range of materials.