Used SPEEDFAM 12B #9399503 for sale

SPEEDFAM 12B wafer grinding, lapping & polishing system is a cost-effective solution for precision surface preparation of wafers. Featuring an integrated design and high-performance components, this machine offers superior accuracy and repeatability to meet the stringent requirements of today's substrates. Using two submicron diamond particles and a high precision spindle, 12B is able to process materials faster and more consistently than previous generations of machines. SPEEDFAM 12B is designed to operate in a process chamber, enabling a clean and controlled environment free from airborne contaminants or abrasive particles. A variety of tools can be employed with the device, ranging from lapping disks for flattening wafers to polishing pads for removing residual surface imperfections. 12B also features a full feedback system that constantly monitors the operation and waste collection, providing customers with real-time data on the repeatability of the process. Additionally, the system is fully modular, allowing for easy installation of parts for further customization and improved surface preparation results. With advances in surface treatment technology and increased demand for tight tolerances, SPEEDFAM 12B is the ideal choice for a clean and cost-effective solution.