Used SPEEDFAM 13B-9P #9187705 for sale

SPEEDFAM 13B-9P is a high-precision wafer grinding, lapping, and polishing equipment designed for the production of surface-perfected semiconductors and other high-tech wafers. Featuring a 13-inch diameter single-plate grinder with a 9-inch diameter disk, SPEEDFAM 13 B-9 P provides a powerful and dependable grinding, lapping, and polishing solution with a high degree of accuracy for manufacturing the most demanding and exacting semiconductor and high-tech wafers. 13B-9P is equipped with a servo motor spindle drive system and a high frequency vibration motor designed to achieve a high-precision grinding surface while reducing deflection due to torque forces and vibration. Its advanced stepper motor drive unit adds superior torque and accuracy to the grinding, lapping, and polishing operations. The spindle drive allows for quick and accurate rotational speeds to provide the best results. 13 B-9 P's 9-inch diameter disk provides a larger contact surface, which leads to more efficient grinding, lapping, and polishing. Its intuitive interface allows for easy operation, so even unskilled users can quickly learn and take full advantage of the machine's capabilities. Additionally, the machine is built with safety features and sensors to protect the operator and the workpiece from potential hazards. For load monitoring, SPEEDFAM 13B-9P relies on the load cell and advanced sensors which, coupled with the machine's integrated PC-based controller, ensure highly precise and repeatable grinding, lapping, and polishing operations. The integrated programmable logic controller (PLC) enables automated operation, while various set-up parameters can be easily configured and saved in the tool's internal database. SPEEDFAM 13 B-9 P is also equipped with a programmable X-Y robotic workchanger allowing for automated disc changing. The asset is designed with safety doors and locks to prevent accidental opening and to maintain a dust-free environment. The built-in operator safety model is designed to immediately stop operation in case of emergency situations. Coupled with the capabilities of today's sophisticated wafer grinding and polishing abrasives and consumables, 13B-9P guarantees superior precision and rapid grinding, lapping, and polishing of wafers to the highest quality standards. The unbeatable combination of advanced technology, intuitive operation, and operator safety systems makes 13 B-9 P the best choice for manufacturing high-precision, semiconductor and high-tech wafers with the utmost accuracy and speed.