Used SPEEDFAM 15B-5L-2M #9031446 for sale

SPEEDFAM 15B-5L-2M is a precision wafer grinding, lapping and polishing equipment designed to meet the demanding requirements of today's semiconductor and other advanced materials processing applications. It is ideal for surface and form grinding, lapping and polishing operations on silicon, gallium arsenide, gallium nitride, GaN, diamond, sapphire and other hard, brittle materials as well as lapping and polishing of optical surfaces. The system is well-suited for pre-thicknessing a multi-level wafer before the final grinding, polishing and lapping process. 15B-5L-2M is equipped with a 15 kW main motor, a 5 kW lapping motor and a 2 kW electro-magnetic chuck for holding the working pieces. It is particularly designed to perform highly efficient contour grinding, flattening and polishing up to 8-inch wafers. The model includes a precision XYZ traverse, an adjustable angle diamond grinding wheel and a direct drive control unit. Thanks to its adjustable angle grinding wheel, the machine is capable of producing intricate shapes and reaching the desired profile angle of the workpiece in one single pass. The high-precision grinding tool offers fast removal rates and grinds to a flatness of 0.2 μm or better. Additionally, SPEEDFAM 15B-5L-2M wafer grinding, lapping and polishing asset has an automated material exchange unit, which ensures fast and accurate automatic part transport from the feeder to the grinding head. A closed loop cooling model allows for efficient cooling, keeping the workpiece temperature low and the grinding process stable. The equipment also incorporates advanced vision systems for visual inspection and process monitoring. The vision system is capable of detecting defects in size, position, area and shape of the workpiece. This feature ensures very accurate and consistent production, ensuring the highest quality of the parts processed. In conclusion, 15B-5L-2M is a high-performance wafer grinding, lapping and polishing unit, which offers excellent accuracy, precision and repeatability for processing the most demanding parts. This machine can be used in a range of industries such as wafer fabrication, LED manufacturing, flat panel display production as well as many other applications.