Used SPEEDFAM 15B-5L #9276639 for sale

SPEEDFAM 15B-5L is a sophisticated wafer grinding, lapping and polishing (WGLP) equipment designed for the most demanding applications. This system provides precision surface finishing and allows low particle concentration and high quality surfaces. With the capability to process 8", 12" and 15" (200/300mm) wafers, the unit features dynamic and repeatable operation as well as a wide range of possible processes. The modular design of this machine consists of three core components to allow for an effective, reliable operation: a grinding station, a polishing station and a lapping station. The grinding station is equipped with a servomotorized spindle capable of high speed turning, giving enormous control over the speeds achieved. The polishing station consists of an advanced polishing wheel with an active cooling machine and variable speed adjustment. Full control over the polishing process is given, allowing for precise particle-size control and finishing parameters. The lapping station is equipped with a variety of presses and polishing technologies for greater accuracy and easier operation. 15B-5L is built for flexibility, with a wide range of operating parameters, such as process parameters, power level, polishing head speed, and other variables. The machine features multiple cooling techniques for efficient heat dissipitation, and its control systems are the latest in automation technology. The full-features robotic arm is designed for reliability with the highest precision. Proprietary software is also included to ensure accuracy and repeatability. This machine offers the ultimate in precision machining for a wide range of applications in semiconductor wafer grinding, lapping and polishing. With SPEEDFAM 15B-5L, users get the advantage of increased accuracy, speed, and cost-effectiveness. This efficient tool is designed for the most challenging production procedures and meets the most stringent industry requirements.