Used SPEEDFAM 15B-5P #9120394 for sale

SPEEDFAM 15B-5P wafer grinding, lapping & polishing equipment is an advanced device designed to achieve ultra-precise surface finishes and geometries on various materials. This wafer grinding machine is equipped with an adjustable frequency driven lapping plate, with motors that spin in both directions to create a fine finish. It features a variety of motor speeds and grinding plates for optimal performance on a wide variety of materials such as nitride, oxide, and plastics. It also includes an automated grinding wheel balancing system, which optimizes the grinding wheel speed & feed to reduce vibration & improve consistency. The machine is also equipped with a control panel with Ethernet connection for easy operation and control. The control panel is capable of controlling individual grinding plates, motor speed, and feed rate for improved precision and accuracy. Additionally, it features an integrated control unit for fast and accurate process monitoring. It also includes an integrated digital interface for both manual and automated operation. 15B-5P wafer grinding, lapping & polishing machine is designed for use in production-level applications. It is equipped with a wide range of options, such as adjustable grinding speeds and various plates to accommodate different materials. It also features a diamond-plate option for extremely hard materials, and a reversing plate option for aluminum grinds. This tool is also designed for quick tool changeovers and easy maintenance, with an enclosed, fully stand-alone cabinet. This wafer grinding machine has a rigid pedestal style design with a heavy-duty A-frame structure to resist vibration and machine movement. It features a five-axis bridge-type construction with double-V slides for rigidity and accuracy. It also comes with a powerful integrated inverter variable speed drive, a powerful vacuum-fed spindle, and a powerful spindle inverter for an optimum speed range. SPEEDFAM 15B-5P wafer grinding, lapping & polishing asset is an ideal choice for those needing an advanced wafer grinding machine. It is capable of achieving ultra-precise surface finishes and geometries on various materials with its adjustable frequency driven lapping plate, various motor speeds, and grinding plates. It also features an automated grinding wheel balancing model, integrated control equipment, and a digital interface for both manual and automated operations. Its heavy-duty A-frame construction and powerful integrated and spindle inverter provide excellent rigidity and accuracy for reliable performance.