Used SPEEDFAM 15B-5P #9208821 for sale

SPEEDFAM 15B-5P is a wafer grinding, lapping, and polishing equipment capable of producing extremely precise and consisendtly fine-grade finishes. This system is a chemical mechanical polishing (CMP) tool and is ideal for grinding, lapping, and polishing wafers for semiconductor, MEMS, and other related applications. This unit uses a rotating control head along with platen and robots to adjust the grinding process and optimize it for your specific application. 15B-5P model has a linear axis locating accuracy of ±2µm, while its repeatability is ±1µm. It also has a repeatability of +-0.5µm in both X(horizontal) and Y (vertical) Axis. SPEEDFAM 15B-5P has a work area that is 15 inches in diameter and 5 inches in depth. This model also features a rotating control head with a wide range of motion and up to 500 RPM, allowing for smooth and easy wafer grinding, lapping, and polishing. 15B-5P also features a variety of grinding stones, abrasives, and polishing media specifically designed for your application. SPEEDFAM 15B-5P also offers a number of other features. These include automatic loading, unloading, and loading transfer, an automated grinding and polishing control machine, a dust reduction tool, and an integrated heat exchanger asset. It also has a self-diagnostic operator interface, a safety interlock model, and a number of other safety features to ensure that all tasks carried out safely and accurately with minimal risk. 15B-5P is a market-leader for wafer grinding, lapping, and polishing and is perfect for manufacturers and professional users in need of a high-performance, efficient and reliable equipment. This machine can provide not only a variety of finishes and complex topographies but also repeatable and satisfying results.