Used SPEEDFAM 16B-4P #9170570 for sale

SPEEDFAM 16B-4P is a wafer grinding, lapping and polishing equipment designed to deliver superior results for a variety of substrates and applications. This system utilizes a combination of grinding, lapping, and polishing techniques to create a precise surface finish necessary for the most demanding wafers. It is comprised of 4 main components: a motorized spindle, two grinding tools, a lapping plate, and a polishing head. The motorized spindle is what powers the entire unit. It has a maximum speed of 16,000 rpm and is capable of providing fast, consistent movement of the grinding and lapping tools. It also has a quick-change feature, which allows for quick switch-over of tool types. Two grinding tools are provided with the unit: a diamond grinding tool and a standard grinding tool. The diamond grinding tool is used to prepare the wafer by removing surface contaminants for further lapping or polishing action. The standard grinding tool is used to smooth out irregularities on the surface of the wafer for a more uniform feel. The lapping plate is what is used to hone out surface irregularities and achieve a uniform surface finish. It is equipped with a rotating spindle that applies pressure to the wafer while sanding is done. It is also capable of operating up to a total pressure of 200 psi. The polishing head is the last component of the machine. This component is used to finish the surface of the wafer to create a mirror-like finish. It is equipped with a variable speed setting which allows the user to obtain different results depending on the application. It also has an auto-reverse feature which helps prevent clogging of the polishing pad. Overall, 16B-4P is an advanced wafer grinding, lapping, and polishing machine which provides superior results for a variety of substrates and applications. It is designed to quickly and accurately achieve a precise surface finish and is capable of delivering superior results.