Used SPEEDFAM 16B-5L #293794262 for sale

SPEEDFAM 16B-5L is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. It is capable of grinding, lapping and polishing wafers up to 5.2 inches in diameter in a single operation. The system features a stainless steel chamber with a one-piece construction, which can hold up to 16 wafers at a time. This is accomplished by having a height adjustable jig plate which allows for the wafers to be positioned at the optimal levels for the process. The grinding process is accomplished with a dual-wheel grinding spindle which is controlled by a four-axis motion controller. This provides a precise method of controlling the grinding process and a smooth surface finish. The lap wheel can be adjusted to permit both single-layer and multi-layer grinding operations. The lapping process consists of a two-stage process. First, the wafer is lapped using a stationary lap wheel and a rotating cup wheel. This helps to generate a planar surface. Then, it is further lapped using a rotating lap wheel and a stationary cup wheel to achieve uniformity. Overlap and hyper-lap processes are also possible with SPEEDFAM 16B5L. The polishing process uses a polishing table, driven by a DC motor. The tumbling table uses a diamond slurry that helps to impart a polished surface to the wafer. The polishing process is monitored by a particle measuring unit to ensure optimum polishing parameters. 16B-5L machine also includes a number of additional features such as a sludge collection tank, coolant filtration tool, automatic operations and a number of safety functions. 16B5L is a reliable and efficient asset for grinding, lapping and polishing wafers. Its advanced features ensure accuracy, efficiency and repeatability, and its compact size allows for use in small spaces. With its versatile and efficient design, SPEEDFAM 16B-5L is an ideal model for any semiconductor industry application.