Used SPEEDFAM 16B-5L #293797039 for sale

SPEEDFAM 16B-5L is a wafer grinding, lapping and polishing equipment used in the semiconductor industry. It is capable of both single wafer and batch processing of wafers up to 8" in diameter. The system is equipped with a 32-position lapping head, allowing for a maximum of 32 wafers to be lapped in a single cycle. The unit is capable of achieving precise grind and lapping results and is ideal for high-volume production and research applications. The machine incorporates a transfer robot that is designed to move wafers vertically between the grinding, lapping and polishing stations. The robot, along with the slnotch wall prevents cross-contamination of particles between grind and polish steps. The lapping head is designed to provide uniform surface finish and provide precise geometries and sizes through advanced grinding, lapping and polishing. A precision air bearing spindle is used to spin the wafer at a constant speed. The spindle is suspended with a force that eliminates vibration and ensures that the wafer remains in the exact same position throughout the grinding process. This helps minimize the possibility of scoring or other damage to the wafer. SPEEDFAM 16B5L tool also incorporates a high-speed, on-board computer that can control all of the functions of the asset. This computer is programmed with special software used to monitor and control the operation of the machine. 16B-5L offers excellent throughput accuracy, repeatability, and surface finish. This machine has the ability to produce wafers that are of the highest quality and accuracy for the semiconductor industry. Its high speed, precise operation, and flexibility makes it ideal for both research and high-volume production applications.