Used SPEEDFAM 16B-5P-4M #9072355 for sale

SPEEDFAM 16B-5P-4M is a highly efficient multipurpose wafer grinding, lapping and polishing system designed to provide optimal results across a wide range of applications. It is able to process up to 16" wafers at a time, with a maximum throughput of 300 wafers per hour. 16B-5P-4M is equipped with a rotary grinder/lapper, two polishers and a high torque drive motor, allowing for precise grinding and polishing operations with a consistent surface finish. Its integrated multi-axis control system accurately controls the rotary grinder, lap speed and feed rate in order to achieve a uniform surface finish. The lapping process can be set to the desired profile by adjusting the tool faces at its center, while the lapped surface can be recirculated. Additionally, it is also able to handle different grinding and polishing requirements, such as dry grinding, semi-wet grinding, and wet grinding. The grinder/lapper on SPEEDFAM 16B-5P-4M is capable of using different abrasive materials, including ultra-precision diamond-coated tools, in order to achieve the desired surface finish. The lapping direction can also be set, enabling grinding and polishing in any desired direction. Additionally, 16B-5P-4M is also equipped with a stopper, allowing the operator to easily interrupt or pause the operation to reset or adjust the tool face. The two polishers on SPEEDFAM 16B-5P-4M are used to achieve a precision polished surface finish in a short amount of time. The polishers are capable of handling both metal and semiconductor wafers, and can use both HEPA-filtered and non-filtered air to achieve the desired results. The polishers also feature adjustable pressure, adjustable speed, and adjustable vibration settings in order to provide optimal polishing results. 16B-5P-4M is of an advanced design, offering a unique combination of efficiency and performance. Additionally, its closed loop, self-contained design reduces airborne dust, providing a clean and safe working environment. The easy to use control panel allows the operator to quickly set up and control the system for optimal results. As such, SPEEDFAM 16B-5P-4M is the perfect choice for wafer grinding, lapping and polishing operations.