Used SPEEDFAM 16B-5P #293589766 for sale

SPEEDFAM 16B-5P is a versatile, high quality wafer grinding, lapping, and polishing equipment. It is designed to accept 4" to 8" wafers and is capable of achieving superior surface finish and consistent results while maintaining the highest levels of throughput and process quality. The wafer grinding system is typically used to remove excess material from wafer surfaces prior to backside grinding or chemical mechanical planarization (CMP). The rotating and fixed lapping plates are driven by servo motor and have adjustable speeds. The unit can be calibrated for various thicknesses of wafer for optimal results. 16B-5P is equipped with a diamond slurry machine for lapping and polishing operations. The diamond slurry is dispensed automatically, ensuring that the correct amount of slurry is applied to the wafer at all times. The slurry is filtered before application, and can be adjusted to the lapping or polishing operations are being performed. The diamond slurry is also temperature controlled to ensure the highest levels of process repeatability. SPEEDFAM 16B-5P is also equipped with an adjustable water pressure tool to ensure that the slurry particles are evenly distributed throughout the work surface. The asset also features an automated pallet model that can be used to transport wafers throughout the equipment. The automated pallet system allows the operator to switch between different workpads and adjust their speed settings. To ensure that the highest standards of process quality are met, 16B-5P possesses several advanced features such as laser surface inspection, process control, real-time wafer reconditioning and temperature control. The laser surface inspection unit allows the operator to detect any irregularities in the wafer surface, whereas the process control machine tracks the entire process and monitor the performance of the tool at all times. The real-time wafer reconditioning ability allows for quick adjustment of the lapping or polishing operations, resulting in improved process quality and increased throughput. Lastly, the temperature control asset enables precise and accurate temperature control, resulting in better wafer uniformity and consistency.