Used SPEEDFAM 16B-5P #9170558 for sale

SPEEDFAM 16B-5P is a wafer grinding, lapping and polishing equipment. It is designed to achieve perfect surface flatness, highly accurate surface finish and overall dimensional accuracy on wafers. This makes it ideal for production-scale operations in the semiconductor industry. At the core of SPEEDFAM is its rigid frame. The frame supports the grinding and polishing head, known as the spindle, and rigidity is achieved by using a heavy cast-iron stand and a sturdy base plate. The grinding and polishing head is designed to deliver superior performance with low vibration and low noise, to ensure precision results. SPEEDFAM is equipped with a precision spindle and a fine-feed controller, both of which are fitted to enable extremely accurate work. The precision spindle delivers controlled speed and accuracy, and its design permits easy replacement of components to extend its usable life. The fine-feed controller allows users to finely adjust the grinding and polishing power, providing greater control over the results. To ensure maximum precision, SPEEDFAM is equipped with an integrated lapping system, which works to ensure that no unwanted particles enter the grind and polish process. This is assisted by the use of a special air filtration unit, which removes dust to maintain in clean air environment. 16B-5P has a variety of features which make it suitable for diverse grinding and polishing operations. Its in-built ABR grinding machine enables fine grinding and polishing of metals and other materials, while its diamond plating tool provide superior polishing result and increases the life of the diamond plates. Furthermore, SPEEDFAM has a polishing plate with a digital filter control to ensure one-touch speed control, and a flexible head mechanism to accommodate thicker wafers. It also features automatic wafer recirculation, which enables quick and easy processing of materials, and a PELCO easy-to-use online operation program for preemptive maintenance and machine updating. Overall, SPEEDFAM 16B-5P is a highly efficient and precise wafer grinding, lapping and polishing asset. With its heavy-duty construction and highly accurate components, it provides superior performance in high-demand production operations, making it ideal for manufacturers in the semiconductor industry.