Used SPEEDFAM 16B-5P #9212539 for sale

SPEEDFAM 16B-5P
ID: 9212539
Double sided lapper machine Platen diameter: φ 1400.
SPEEDFAM 16B-5P is a high-precision, robust wafer grinding, lapping and polishing equipment enabling users to process huge quantities of wafers in a fast and efficient manner. As an automated system, its CNC platform-based machine construction can be adapted to accommodate various types of operations for different applications. The unit contains a standard 16-seed wafer carrier with a maximum substrate of 200 mm in diameter. This allows users to easily and safely transport wafers in the machine. The machine also includes a PLC-controlled, 5-step lapping and polishing process that enables quick processing time of wafers with a precision of up to 1 µm. 16B-5P wafer grinding, lapping and polishing comprises several mechanisms for effective grinding, lapping and polishing of wafers to provide greater accuracy and enhanced smoothness. It is equipped with water-cooled, ruby lap, diamond lap, and in-line polishing process enhancing precision and conductivity for better-quality results. Additionally, the machine features a dispersal wheel to keep the abrasive media distributed evenly over the whole wafer area, which greatly simplifies the wafer manufacturer's work. The tool utilizes a spindle drive motor with speed control and auto-shutoff, ensuring process continuity and safety when using the various grinding, lapping and polishing tools. It also features a diagonal wheel and silicone seals for complete wafer protection during the entire lapping process. Additionally, the asset utilizes centrifugal force to ensure uniform grinding along with integrated vacuum systems to keep the grinding media free and to evacuate ground material from the wafers. SPEEDFAM 16B-5P model offers an all-in-one wafer grinding, lapping and polishing solution for a variety of wafers. The smart features make it easy to use and maintain, while providing consistent and reliable results. The result is a cost-effective, highly efficient wafer grinding, lapping and polishing equipment with maximum flexibility and precision.
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