Used SPEEDFAM 16B-5P #9223968 for sale

SPEEDFAM 16B-5P wafer grinding, lapping and polishing equipment is ideal for applications requiring precise conditioning of semiconductor surfaces. This versatile machine offers automated grinding, lapping, and polishing processes for processing both single and multi-chip semiconductor wafers. The system is capable of performing grinding, lapping, and polishing operations in one pass, while maintaining high levels of accuracy. 16B-5P consists of a loading module, a grinding module, a lapping module, an unloading module, a polishing module, and a cleaning module. The loading module is designed to securely mount wafers up to 15-inch diameter onto the processing platform. The grinding module is capable of removing up to 5 microns of surface material using diamond grinding wheels rotating at high speeds. The lapping module uses either two or four diamond-sintered abrasive plates which rotate at high speeds to finish the wafers surface. The unloading module handles the removal of the wafers from the processing platform while the polishing module uses a polishing pad with slurry for the final finishing of the wafers. The cleaning module is equipped with ultrasonic cleaning tanks and air knives to ensure a clean final product. SPEEDFAM 16B-5P is also equipped with an advanced electronic control unit for maximum safety and precision. This machine enables the user to program parameters such as grit size, processing time, number of passes, and number of wafers to be processed. In addition, the tool can be programmed with user-defined recipes for varying production needs. The asset also includes a remote monitoring feature that allows users to check model performance remotely. Overall, 16B-5P is a robust and reliable wafer grinding, lapping and polishing equipment, perfect for semiconductor fabrication processes that require high levels of accuracy and repeatability. It is easy to use, reliable, and sure to offer many years of reliable service.