Used SPEEDFAM 16B-5SSG-2M #9257687 for sale

SPEEDFAM 16B-5SSG-2M is a multi-functional wafer grinding, lapping, and polishing equipment designed for advanced semiconductor processing. This system consists of an integrated machine frame with five spindles that can handle up to 16" wafers. Each spindle accommodates up to two 8" cassettes, or one 16" cassette. The provided servo motor produces a constant work speed with a maximum speed of 300 RPM, while the power feed holders apply regulated force to the grinding and/or lapping process. The unit's primary application is ultra-precision grinding and polishing of thin or delicate substrates, such as silicon wafers and ultra-thin glasses. The cross-axis grinding station provides high quality machining, across all axial directions. The machine also incorporates a Work-In-Process (WIP) cassette station to ensure each grinding and/or lapping job is completed in the time designated. This is done through palletized automation, to ensure jobs are quickly and accurately transferred in and out of 16B-5SSG-2M. The addition of an automated fluid dispensing tool provides fast and accurate fluid delivery, to ensure optimal performance of the grinding, lapping, and polishing processes. This asset is managed by a user-friendly interface with on-screen machine control, which allows operators to monitor critical parameters including grinding speed, cutting force, and fluid level. Additionally, software-controlled digital drying chambers are available to produce coating and abrasion resistance, and help reduce rejects due to mishandling. The model includes built-in safety features, such as a 'lock-out' function to help prevent accidental operation during maintenance. The door interlock equipment also ensures personnel safety during maintenance and operation. The system is designed with low noise operation and minimized vibration to ensure operator comfort and reduce any environmental impact. SPEEDFAM 16B-5SSG-2M has been proven to be a cost-effective, reliable, and accurate solution for semiconductor finishing.