Used SPEEDFAM 16B #293647786 for sale

ID: 293647786
Lapping machine.
SPEEDFAM 16B is a wafer grinding, lapping and polishing equipment designed for MEMS and other micro applications. It is a highly precise, automated system that is capable of producing superior quality results with exceptional repeatability and throughput. The key features of SPEEDFAM 16 B include its design for maximum uptime, low maintenance and efficient operation. 16B utilizes four independent grinding stations that enable efficient grinding of the wafers. This permits a high degree of automation and accuracy with the ability to switch from one wafer to another in a matter of seconds. The machines is equipped with precision linear guideways and brushless motors for vibration free motion of the linear components. Additionally, self-aligning linear bearing are also employed in this unit to ensure optimal accuracy. The machine is also equipped with two independent lapping/polishing stations. The lapping/polishing stations allow for precise surface finishes and can be operated at programmable speeds. The station utilizes a unique abrasive media which is specifically designed to optimize the grinding and polishing process. This abrasive media has an asymmetrical pattern and is capable of producing results with excellent repeatability and a high degree of accuracy. The systems benefits from a modern, digital control tool which allows for efficient and reliable control of the machining process. The controller is capable of operating on a variety of external platforms and can be easily integrated into factory networks and systems. Additionally, the asset is equipped with an intuitive touchscreen display that enables operators to easily interact with the model. Finally, 16 B is designed for easy maintenance and parts replacement. All of the components are easily accessible and can be quickly replaced with minimal effort. Additionally, the equipment is designed for safe operation and is compliant with OSHA requirements. In conclusion, SPEEDFAM 16B is a highly precise, automated wafer grinding, lapping and polishing system. The key features of this unit include its design for maximum uptime, low maintenance and efficient operation, precise linear guideways and brushless motors, unique abrasive media and intuitive touchscreen display. This machine is ideal for the production of superior quality results with exceptional repeatability and throughputs.
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