Used SPEEDFAM 16B #293656104 for sale

SPEEDFAM 16B wafer grinding, lapping & polishing equipment is capable of producing higher quality parts with improved efficiency and throughput. This system is used to provide precision lapping, grinding, and polishing of wafers with minimal operator involvement. The unit comes with a powerful 5 hp motor, and a three-stage spindle to achieve precision and fast cycle times. SPEEDFAM 16 B comes with several convenient features such as a lubricant injection machine and a wafer clamping tool that helps maintain secure and stable wafers during grinding, lapping and polishing operations. This asset also comes with a self-aligning spindle which allows for accurate grinding, lapping, and polishing operations. The model has a modular design and can easily be installed in existing workspace. The accuracy of the machine is ensured by its use of a high-torque, two-directional contact equipment. The unique combination of abrasive components aligned positioning ensure that 16B can perform under the most demanding requirements. The system is equipped with a pressure adjustment unit which helps create uniform and precise pressures for lapping, grinding, and polishing. The pressure adjustment machine is capable of delivering pressures of 0.2 to 13.6 kgf/cm2 (0.2 to 13.6 bar). This helps ensure that superior results are consistently achieved. 16 B offers a range of parameters that can be adjusted. These include dressing speeds, grinding rates, polishing speeds, and the range of polishing options. The three-stage spindle is controlled by a programmable logic controller (PLC). The PLC allows for precise control of the spindle speed, position, and orientation. This tool also has an automatic cycle stop feature that ends lapping, grinding, and polishing when the desired result is achieved. The touch screen control panel makes the asset simple to operate. It also features various options for data logging, which can help you monitor the process in order to make any necessary corrections. SPEEDFAM 16B is a reliable model that can provide fast, accurate, and consistent results. This equipment is ideal for the precision lapping, grinding, and polishing of semiconductor and optical wafers as well as small and large components. With its advanced features, this system ensures that the highest levels of precision and accuracy can be achieved.