Used SPEEDFAM 16B #293656116 for sale

SPEEDFAM 16B Wafer Grinding, Lapping and Polishing Equipment is designed to process flat, circular silicon wafers up to 300 mm in diameter. The system utilizes a "wet-belt" finishing process which utilizes diamond-impregnated belts, belt grinding, direct localised lapping, and final polishing with superior results for both front and back side processing of highly flat wafers. SPEEDFAM 16 B unit is designed around two matched Cast Pressure Vessels, each containing a perforated plate. The two casings are connected and act as an upper and lower platen for loading and clamping the wafer. Each vessel contains a slurry injection port for supplying the diamond abrasive medium or coolant. The wafer is manually loaded between the platen and clamped tightly to properly secure the wafer. The bottom casing also houses a grinding belt, while the top casing is used to house the lapping and polishing compounds. To ensure a superior finish, 16B machine utilizes a specially engineered double-diamond belt tool. A 50-micron abrasive belt is used to cut the wafer to a planar surface, and then a 10-micron belt is used to smooth out minor imperfections. The second belt is finer and allows for higher precision during the grinding process, as well as eliminating any possible chances of grinding dust particles getting embedded in the wafer itself. Once the wafer has been ground to the desired thickness, the localised lapping and polishing process is used to finish the surface. A combination of water-soluble and oil-soluble polishing agents are applied to the bottom of the wafer, and a vacuum apparatus is used to lift the wafer before being lowered onto the top casing. This allows for localized lapping and polishing to take place. The wafer is eventually immersed in a slurry of naturally-abrasive particles and kept in motion by two vacuum-actuated indexers. This process brings the surface of the wafer to a high optical finish, resulting in low surface roughness and edge burrs. To complete the polishing process, the wafer is then subjected to high-pressure diamond pad finishing, using an oscillating motion. This ensures that the wafer is uniformly polished and can withstand high temperatures and extreme pressure. Once the wafer is finished, it undergoes a rigorous quality assurance procedure, with a vacuum apparatus used to measure flatness, thickness, surface roughness, and more. This two-platen asset is capable of producing highly flat, high-quality wafers with superior surface finish and edges while maintaining a superior level of performance and cost efficiency.