Used SPEEDFAM 16B #293825222 for sale

SPEEDFAM 16B wafer grinding, lapping & polishing equipment is a state-of-the-art tool used to process semiconductor wafers to precise geometries. It is a machine that utilizes a combination of grinding, lapping and polishing techniques to ensure maximum accuracy and precision when creating wafers. The machine is made to process a wide range of wafer sizes from 4" to 8"; it is capable of both mechanical texturing and chemical mechanical processing while maintaining a high degree of reproducibility and repeatability. SPEEDFAM 16 B is equipped with a patented, high-efficiency grinding and lapping technique that enables the processing of a wide range of substrates including silicon and GaAs. This technique utilizes a one-step simultaneous grinding operation to produce extremely high precision results. This patent technology as well as the combination of grinding, lapping and polishing enhances the overall performance of the machine and provides users with precise and repeatable results. 16B consists of a computer-controlled touchscreen, a spindle motor, a X-Y stage, and an automatic coolant system. The integrated touchscreen allows the user to enter parameters for grinding, lapping, and polishing operations quickly and easily without sacrificing accuracy. The integrated spindle motor with independent controller enables the user to adjust the speed of the grinding spindle to customize the operation according to the specific processing requirements. The X-Y stage provides support for the workpiece during the processing operation and the coolant unit provides effective cooling and lubrication. 16 B also features intuitive software with a user-friendly graphical interface for easy operation. The software allows for the automation of bore grinding and concentricity measurements that greatly reduces setup and operation time. Furthermore, the integrated vision machine improves process capability and provides users with detailed analysis of defects, allowing quick process corrections. Overall, SPEEDFAM 16B wafer grinding, lapping & polishing tool is an excellent choice for research laboratories and manufacturers that require a dependable and precise machine for wafer processing. The combination of advanced technology, intuitive software, and user-friendly controls make SPEEDFAM 16 B an invaluable tool for industry professionals.