Used SPEEDFAM 16B #293825223 for sale

SPEEDFAM 16B Wafer Grinding, Lapping, and Polishing Equipment is an advanced grinding and polishing system designed for precision wafer grinding, lapping, and polishing. This unit provides high-precision features necessary for the production of wafer components for various applications. SPEEDFAM 16 B utilizes a set of high-torque vertical spindles fitted with grinding and lapping heads to generate a high-precision grinding and polishing surface. Each spindle contains multiple brushless motors that deliver a range of adjustable speeds to ensure high-quality finishes. The vertical spindles also feature a patented turret design that allows the machine to perform multiple passes to generate more uniform and consistent finishes. The high-torque spindles are capable of generating up to 450Nm of applied torque as needed to complete grinding and lapping operations. 16B is also constructed with a modular design which allows for the addition of various grinding and polishing track accessories. The standard tool includes various working modules for wafer thickness adjustment, flat grinding, contour grinding, buffing, and polishing. Each of the modules can be used individually to produce different sizes and shapes of wafers based on a user's specific requirements. Additionally, the asset is capable of adjusting the grinding pressure and parameters for each wafer to deliver optimal results. 16 B also features a slotted air baffle which minimizes air turbulence on the work surface during operation and keeps the area clean. Additionally, the model is designed to maximize operator safety. The grinding and lapping heads are carefully enclosed, minimizing the risk of exposure to flying debris and splashes. SPEEDFAM 16B is a highly efficient and durable wafer grinding, lapping, and polishing equipment. It is also user-friendly and cost-effective, featuring a simple system architecture that makes setup and operation easy. As a result, it is a reliable, accurate and efficient grinding and polishing choice for any precision wafer manufacturing process.