Used SPEEDFAM 16B #293825224 for sale

SPEEDFAM 16B is a wafer grinding, lapping and polishing equipment designed for precision surface finishing of semiconductor wafers. This system produces high-precision wafer surfaces with a consistent, uniform finish that meets the industry standards for semiconductor devices. SPEEDFAM 16 B is designed to provide a consistent, repeatable process on a variety of different materials, from hard non-working layers of Si and SiO2 to thin single crystal layers of III-V compound semiconductor materials. 16B provides wafer grinding, lapping and polishing capabilities up to 300mm in diameter. The unit is optimized for materials that require exacting surface finish, such as sapphire and diamond crystal wafers. The machine is equipped with a precision spindle machine that allows for grinding and lapping operations, as well as fine polishing operations where extremely smooth, uniform finishes are required. The tool also features a ranging head with a variety of different grinding and lapping stones that makes it easy to produce the required finish on any material. The integrated contact detection asset senses the current state of the material, allowing for precise control of the grinding and lapping process. 16 B also offers an adjustable air bearing for handling wafers suspended in air, which reduces the possibility of contamination and warping as a result of poor handling. SPEEDFAM 16B has a process chamber temperature range of 20-80° Celsius, which is ideal for thermal processes. The model also comes with an integrated image equipment for wafer inspection and defect analysis. This image system can be used to identify wafer defects quickly and accurately, helping to ensure consistent process results. Additionally, the unit includes advanced process monitoring and measuring capabilities to ensure superior finish quality. Overall, SPEEDFAM 16 B is an ideal solution for operations that require precision surface finish in a variety of materials. The advanced process monitoring and measuring capabilities, combined with the integrated imaging machine, helps ensure superior finish quality and consistent results. The adjustable air bearing feature also helps reduce the chances of wafer warping and contamination. Taken together these features make 16B is an efficient, reliable, and affordable solution for wafer grinding, lapping and polishing.