Used SPEEDFAM 16B #293825437 for sale

SPEEDFAM 16B is a precision wafer grinding, lapping and polishing equipment from SPEEDFAM, a leading provider of grinding, polishing, and lapping systems for industrial and semi-conductor applications. This system is suitable for high-volume production of large numbers of small and medium-sized wafers. It is designed to offer superior repeatability and ease of operation in multiple production areas. SPEEDFAM 16 B utilizes a four-zone orbital lapping and grinding unit that provides both lapping and grinding capabilities. The 16-inch frame in 16B machine capable of accommodating wafer sizes up to 20 inches in diameter. This allows for rapid & precise wafer processing. The high-torque spindles also provide precise and repeatable grinding parameters for precise, repeatable, high-quality results. Other features of this tool include a four lifting zones that can automatically lift the wafers for faster loading and unloading, as well as an optional dwell zone for extended operations and increased accuracy. 16 B also has a dust collection asset to provide clean, dust-free environment and ensure optimal performance. The model also provides a robust control equipment with adjustable power settings and programmable grinding cycles, enabling a reproducible and repeatable process. SPEEDFAM 16B is designed to be serviced and maintained easily, ensuring lasting reliability and productivity. In addition to its lapping and grinding capabilities, SPEEDFAM 16 B also offers an optional Polishing Kit, which allows manual polishing of precision surfaces. This kit includes everything needed, from polishing abrasives to felt-backed pads to the specialized diamond polishing pads. 16B provides a highly versatile and accurate wafer grinding, lapping, and polishing system that is ideal for high-volume production. Its precise grinding and lapping capabilities, dust collection unit, and optional polishing kit make it a valuable tool for semiconductor, component, and medical device manufacturers.