Used SPEEDFAM 16B #293825438 for sale

SPEEDFAM 16B is a wafer grinding, lapping & polishing equipment, designed for the production of low-roughness wafers in high volume. It is designed to process wafer sizes of 6" and 8" diameters, and is capable of processing up to 4,000 wafers per hour. Features such as automatic loading and unloading and a fully automated end point detection system make SPEEDFAM 16 B a reliable, high-volume solution for a variety of applications. The unit includes a main body/base which houses the grinding/lapping/polishing heads, loading/unloading arms and other components. The grinding/lapping/polishing heads are mounted on a rotative table and are adjustable in both height and angle. The adjustable height and angle allows for adaptation to different wafer sizes and shapes. Additionally, the heads are equipped with a spiral grinding/polishing speed, variable from 0-600 rpm, for a variety of force, speed and pressure combinations. The loading/unloading arms are a motorized roller machine connected to a two-channel automatic holder. The loading arm is equipped with two rollers and a tray containing five wafer holders. The holder is designed to automatically move the wafers out of the tray and into the tool, while the unloading arm returns the treated wafers to the tray. For controlling the asset there is a 16" control panel that is integrated with the main body. This allows the operator to easily monitor, adjust and control the operation of the model. The control panel also comes with a USB port and an Ethernet connection, enabling remote access and operation of the equipment. 16B is capable of treating a variety of wafer surfaces, including ones coated with gold, nickel, aluminum, titanium and tungsten. It is equipped with in-process sensors for measuring parameters such as pressure, temperature, grinding time and product quality. This data can be monitored through the control panel and used for optimization of each process. 16 B is a sophisticated and reliable system for high-volume production of low-roughness wafers. Its range of features and capabilities make it suitable for a wide range of applications in wafer grinding, lapping and polishing.