Used SPEEDFAM 16B #293829290 for sale

SPEEDFAM 16B is a state of the art wafer grinding, lapping and polishing equipment, designed and manufactured by Japanese company SPEEDFAM Corporation (formerly SPEEDFAM Co., Ltd.) It is an ideal system for usage in the semiconductor industry. The machine uses a combination of 'grinding force' and 'lapping force' to help enhance the quality of the wafer surface. Grinding force helps remove roughness from the surface, while lapping force works to level out surface defects. It can handle wafers up to 16 inch in diameter and has two separately adjustable grinding stones, two separately adjustable lapping plates and two independently operated polishing heads. The motorized grinding and lapping of the wafers is controlled by a sensitive pressure, current and RPM controlled unit. The polishing heads are operated by an advanced PLC control machine, which uses speed sensors to provide high precision control over the polishing speed. This helps ensure the wafers receive consistent and uniform surface finishes. An automated loading and unloading tool is included, allowing for efficient wafer handling. The asset also includes feedback mechanisms such as pressure sensors on the grinding/lapping plates and polishing heads to give operator feedback on the status of the wafer. This helps ensure a consistent performance throughout the grinding, lapping and polishing cycles. SPEEDFAM 16 B is compact, with a small Footprint, and the whole model is designed to provide easy access for maintenance. Integrated safety features such as emergency stop and dust removal systems help ensure a safe working environment. Overall, 16B is an industry standard equipment for grinding, lapping and polishing wafers. Its advanced features, precision and reliability make it an ideal tool for the semiconductor industry.