Used SPEEDFAM 16B #293829609 for sale

SPEEDFAM 16B wafer grinding, lapping and polishing equipment is an all-in-one wafer surface finishing solution. It is a unique, semi-automated grinder-lapper that can be used to process a wide range of semiconductor or photovoltaic related materials. This machine offers a variety of benefits to users including maximum throughput efficiency, high precision and accuracy and low abrasive loss. SPEEDFAM 16 B offers two grinding spindles that can be adjusted to achieve a wide range of different grinding speeds. The two spindles are also able to accommodate both 2" and 16" wafers. The system also comes with SPEEDFAM SpeedGrind software which provides the user with control over the grinding speed and the capability to adjust the cutting force up to a maximum of 3,000 lbs. Additionally, the software enables the user to program the lapping process for their specific application requirements. 16B utilizes a flexible range of modular grinding and lapping components, enabling the user to customize the machine to their precise application requirements. Its design makes it possible to easily switch between different lapping plates and polishing pads for various configurations. This is further complemented by a quick water tank for cooling and a spark detector unit for precise monitoring of the lapping process. 16 B also boasts a robust and durable construction with stainless steel components and a vacuum machine that ensures dust-free grinding and lapping. To protect the tool from potential damage, it is also equipped with an emergency stop function. Overall SPEEDFAM 16B provides a reliable, efficient and accurate wafer grinding, lapping and polishing asset. With its flexible range of configurations, its ease of maintenance and its advanced safety and monitoring functions, it offers users a reliable and precise alternative to other wafer surface finishing methods. SPEEDFAM 16 B is the perfect choice for those looking for an all-in-one solution for their surface finishing needs.