Used SPEEDFAM 16B #293829610 for sale

SPEEDFAM 16B is a state-of-the-art precision grinding, lapping and polishing equipment that is used to produce high quality wafers for the semiconductor and related industries. The system is designed to offer high performance wafer grinding, lapping and polishing solutions in both wet and dry processes. It is suitable for most substrates including Silicon, Quartz, Silicon Nitride, Sapphire and Ceramics. The unit includes a grinding head featuring a 7.5kW variable frequency motor, allowing for high processing speeds and low grinding noise. The head includes a preset stroke length, and a digital readout that displays the strike number and the number of strokes used. The grinding head is also equipped with self-adjusting pressure pads to ensure uniform grinding. The lapping machine incorporates a variable speed lapping motor, allowing for accurate grinding speed settings and controlled lapping speeds. An abrasive polishing tool is also included, which is integrated with the grinding asset. The abrasive polishing model includes a polishing wheel with adjustable speed, and a polishing liquid that can be tailored to meet the substrate requirements. In addition, the equipment also includes a vacuum system designed to help prevent particles from settling on the substrate surface during lapping or polishing. This allows for clean, high quality wafers. SPEEDFAM 16 B has been designed with a user friendly interface, offering easy-to-follow instructions for grinding, lapping and polishing. The unit is capable of producing high quality wafers quickly and accurately with minimal operator intervention. It is designed to be reliable, efficient and cost-effective.